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A Product Line of
Diodes Incorporated
ZXGD3005E6
Typical Application Circuit
V S
V CC
V CC
SOURCE R SOURCE
IN
ZXGD3005
SINK
R SINK
V EE
Maximum Ratings @T A = 25°C unless otherwise specified
Characteristic
Supply voltage, with respect to V EE
Input voltage, with respect to V EE
Output difference voltage (Source – Sink)
Peak output current
Input current
Symbol
V CC
V IN
Δ V (source-sink)
I PK
I IN
Value
25
25
±7.5
±10
±100
Unit
V
V
V
A
mA
Thermal Characteristics @T A = 25°C unless otherwise specified
Characteristic
Power Dissipation (Notes 4 & 5)
Linear derating factor
Thermal Resistance, Junction to Ambient (Notes 4 & 5)
Thermal Resistance, Junction to Lead (Note 6)
Operating and Storage Temperature Range
Symbol
P D
R θ JA
R θ JL
T J, T STG
Value
1.1
8.8
113
105
-55 to +150
Unit
W
mW/ ° C
° C/W
° C
Notes:
4. For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition. The heatsink is split in half with the pin 1 (V CC ) and pin 3 (V EE ) connected separately to each half.
5. For device with two active die running at equal power.
6. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (V CC ) and pin 3 (V EE ).
ZXGD3005E6
Document Number DS35095 Rev. 4 – 2
2 of 8
www.diodes.com
March 2011
? Diodes Incorporated
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